AI Technology, Inc.

AI Technology, Inc.

Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology has been one of the leading forces in the development of advanced material and adhesive solutions including: Insulated Metal Substrates, Gap-Filling Compressible Phase-Change Pads, Thermal Gels, Thermal Grease, Stress-free Adhesive Films, Adhesive Pastes, RF/EMI shielding solutions, and Copper-Clad Laminates. AI Technology’s ISO9001:2000 certified facility produces an extensive line of adhesive materials that include: Conductive and Dielectric materials, high operating temperature adhesive solutions, room temperature cure materials, solvent free material, Z-Axis conductive material along with Mil Std 883; Method 5011.5 testing and NASA / ESA ASTM E 595 Outgassing qualified and are ITAR controlled. AI Technology also has service centers in China and more than 10 sal

Adhesives; Epoxies; Die Attach Compounds; Under fill, Package Substrates; Laminate; Film based, Tape Automated Bonding (TAB) Accessories, Thermal Interface Materials; Heat Sinks, Thick Film Pastes; Materials, Thin Film; Dielectric Film Materials, Other Specialty Chemicals, Surface protection material; coatings